REFLOW SOLDERING
SRO-700
Table top – IR vacuum reflow system
The SRO-700 reflow oven is an ideal solution for semiconductor and MEMS applications, providing 100mm of clearance over the heated surface. It can be used for thermal annealing and reflow soldering processes, making it the perfect R&D tool. The cold wall chamber principle, IR lamp heating, as well as vacuum and formic acid capabilities ensure excellent process repeatability and void-free solder joints.
Facts & Options
Information Request
Highlights
SRO-700
- Formic Acid Enriched Atmosphere
- Direct IR Heating
- Multiple TC monitoring
- Process temperature 450°C
- Oxygen < 1.0 ppm with purified N2
- 100 steps / recipe program
Common Applications
SRO-700
- IGBT / DBC
- Power Semiconductors
- Sensors
- MEMS Devices
- DIE Attachment
- High Power LED
- Hybrid Assembly
- Flip Chip
- Package Sealing
Technical Data
SRO-700
depending on system configuration/optionals
-
Footprint
- 565 x 601 x 800 mm (LxWxH)
-
Weight
- 85 kg (minimum configuration)
-
Chamber Height
- 100 mm
-
Heated Area
- 230 x 217 mm
-
Chamber Lid Open/Closing
- Manual
-
IR Heating
- Array of 8 IR lamps in Quartz glass tubes (2 heating zones)
Options
SRO-700
- Spring Pin Array (in chamber lid)
- Custom tailored substrate fixture
- Spring clamps on hot plate
- Low vacuum, fine vacuum, high vacuum
- Closed loop water chiller/heater
SRO-700
Table top – IR vacuum reflow system
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