COMPRESSION BONDING
SRO-TCB
Programmable oven with inflatable membrane for thermo compression bonding application
The SRO-TCB, Thermal Compression Bonding system, is based on our successful SRO product line. A pressing unit in combination with an elastomer membrane applies a pressing force up to a maximum of 0.5 MPa to the products over a workig surface of above Ø 150 mm. A special design prevents positional shifting of the components during the process. The SRO-TCB can process assemnlies with different topographies at the same time without compromising the results. Like our standard SROs, the SRO-TCB is equipped with a cold wall chamber, IR heating, a vacuum system, and formic acid evaporator to ensure robust solder connections in a variety of applications.
Facts & Options
Information Request
Highlights
SRO-TCB
- Viewing window
- Press unit ≤ 0.5 MPa gas pressure
- Individually programmable soldering profiles with recording and documentation of the process flow
- Formic acid process for flux-free soldering
- Vacuum for void-free soldering
- Process temperature up to a max. of 300°C depending on the bonding KIT
- Oxygen < 1.0 ppm with purified N2
Common Applications
SRO-TCB
- Transient Liquid Phase Bonding (TLPB) / Soldering
- Cu pillar / micro bump flip chip soldering
- Low pressure silver sintering
- Micro Peltier / TEC Bonding / Soldering
Technical Data
SRO-TCB
depending on system configuration/optionals
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Dimensions
- 760 x 960 x 1800 (LxWxH)
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Weight
- 240 kg (minimum configuration)
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Working Height
- 950 – 1080 mm adjustable
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Distance membrane above heated plate
- Up to 12 mm for the pressing unit
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Heated Area
- Ø160 mm for the bonder configuration
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Chamber Lid Open / Closing
- Automatic lid closing / opening and locking / unlocking
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Heating
- PID controlled IR lamp array heating principle of heated plate
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Cooling
- Cold wall technology
- Cooling with nitrogen
Options
SRO-TCB
- Customized Tooling
- Various vacuum pumps
SRO-TCB
Programmable oven with inflatable membrane for thermo compression bonding application
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